Computer mainframe front panel

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Description

FIG. 1 is a top, front and right side perspective view of a computer mainframe front panel showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

The ornamental design for a computer mainframe front panel, as shown and described.

Referenced Cited
U.S. Patent Documents
D454133 March 5, 2002 Yang
D464357 October 15, 2002 Chien et al.
Patent History
Patent number: D485277
Type: Grant
Filed: Jan 22, 2003
Date of Patent: Jan 13, 2004
Assignee: Thermaltake Technology Co., Ltd. (Taipei Hsien)
Inventor: Hui-Chia Huang (Taipei Hsien)
Primary Examiner: Freda Nunn
Attorney, Agent or Law Firm: Rosenberg, Klein & Lee
Application Number: 29/174,548
Classifications
Current U.S. Class: Including Surface Texture (D14/444)
International Classification: 1402;