Computer mainframe front panel
Latest Thermaltake Technology Co., Ltd. Patents:
Description
FIG. 1 is a top, front and right side perspective view of a computer mainframe front panel showing my new design;
FIG. 2 is a front elevational view thereof;
FIG. 3 is a rear elevational view thereof;
FIG. 4 is a left side view thereof;
FIG. 5 is a right side view thereof;
FIG. 6 is a top plan view thereof; and,
FIG. 7 is a bottom plan view thereof.
Claims
The ornamental design for a computer mainframe front panel, as shown and described.
Referenced Cited
Patent History
Patent number: D485277
Type: Grant
Filed: Jan 22, 2003
Date of Patent: Jan 13, 2004
Assignee: Thermaltake Technology Co., Ltd. (Taipei Hsien)
Inventor: Hui-Chia Huang (Taipei Hsien)
Primary Examiner: Freda Nunn
Attorney, Agent or Law Firm: Rosenberg, Klein & Lee
Application Number: 29/174,548
Type: Grant
Filed: Jan 22, 2003
Date of Patent: Jan 13, 2004
Assignee: Thermaltake Technology Co., Ltd. (Taipei Hsien)
Inventor: Hui-Chia Huang (Taipei Hsien)
Primary Examiner: Freda Nunn
Attorney, Agent or Law Firm: Rosenberg, Klein & Lee
Application Number: 29/174,548
Classifications