Heat sink

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Description

FIG. 1 is a perspective view of a heat sink;

FIG. 2 is a front elevation thereof;

FIG. 3 is a rear elevation thereof;

FIG. 4 is a left side elevation thereof;

FIG. 5 is a right side elevation thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom view thereof.

Claims

The ornamental design for a heat sink, as shown and described.

Referenced Cited
U.S. Patent Documents
D426195 June 6, 2000 Kuo
D426814 June 20, 2000 Lee
6289975 September 18, 2001 Kuo
D458232 June 4, 2002 Lee
6883592 April 26, 2005 Lee
20060028798 February 9, 2006 Wang
20070131389 June 14, 2007 Chen et al.
Patent History
Patent number: D561710
Type: Grant
Filed: Jan 3, 2007
Date of Patent: Feb 12, 2008
Assignee: Thermaltake Technology Co., Ltd.
Inventor: Pei-Hsi Lin (Taipei County)
Primary Examiner: Selina Sikder
Attorney: Schmeiser, Olsen & Watts
Application Number: 29/275,646
Classifications
Current U.S. Class: Heat Sink (D13/179)