Portion of a matrix for surface mount package leadframe

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Description

FIG. 1 is a top plan view of a portion of a matrix for surface mount package leadframe showing my new design;

FIG. 2 is a top plan view of an enlarged fragment of the portion of a matrix for surface mount package leadframe; and,

FIG. 3 is a perspective view of a portion of a matrix for surface mount package leadframe.

Claims

The ornamental design for a portion of a matrix for surface mount package leadframe, as shown and described.

Referenced Cited
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Patent History
Patent number: D488136
Type: Grant
Filed: Jan 3, 2003
Date of Patent: Apr 6, 2004
Assignee: GEM Services, Inc. (San Jose, CA)
Inventors: James Harnden (Hollister, CA), Richard K. Williams (Cupertino, CA), Anthony Chia (Singapore), Chu Weibing (Shanghai), Allen K. Lam (Fremont, CA)
Primary Examiner: Philip S. Hyder
Assistant Examiner: Selina Sikder
Attorney, Agent or Law Firm: Townsend and Townsend and Crew LLP
Application Number: 29/173,646
Classifications
Current U.S. Class: Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)
International Classification: 1303;