Light emitting diode package

- Harvatek Corporation
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Description

FIG. 1 is a top perspective view of the coplanar metal plates of the light emitting diode package, shown separately for ease of illustration;

FIG. 2 is a bottom perspective view of the coplanar metal plates of the light emitting diode package, shown separately for ease of illustration;

FIG. 3 is a top plan view of the light emitting diode package wherein the coplanar metal plates are embedded;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a left side elevation view thereof;

FIG. 6 is a right side elevation view thereof;

FIG. 7 is a front side elevation view thereof; and,

FIG. 8 is a back side elevation view thereof.

Claims

The ornamental design for a light emitting diode package, as shown and described.

Referenced Cited
U.S. Patent Documents
4727457 February 23, 1988 Thillays
5369551 November 29, 1994 Gore et al.
6028351 February 22, 2000 Klonis et al.
6105226 August 22, 2000 Gore et al.
6300674 October 9, 2001 Wang
6422716 July 23, 2002 Henrici et al.
D476959 July 8, 2003 Yamada et al.
D499075 November 30, 2004 Yoon et al.
Patent History
Patent number: D507246
Type: Grant
Filed: Apr 10, 2003
Date of Patent: Jul 12, 2005
Assignee: Harvatek Corporation (Hsin-Chu)
Inventors: Bily Wang (Hsin-Chu), Jonnie Chuang (Taipei)
Primary Examiner: Stella Reid
Assistant Examiner: Selina Sikder
Attorney: Rosenberg, Klein & Lee
Application Number: 29/179,370
Classifications
Current U.S. Class: Electron Or Vacuum Tube (23) (D13/180)