Light emitting diode package
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FIG. 1 is a top perspective view of the metal plates of the light emitting diode package, shown separately for ease of illustration;
FIG. 2 is a bottom perspective view of the metal plates of the light emitting diode package, shown separately for ease of illustration;
FIG. 3 is a top plan view of an alternate embodiment of the light emitting diode package showing a LED chip;
FIG. 4 is a rear perspective view of the light emitting diode wherein the metal plates are encapsulated;
FIG. 5 is a top plan view thereof;
FIG. 6 is a bottom plan view thereof;
FIG. 7 is a left side elevation view thereof;
FIG. 8 is a right side elevation view thereof; and,
FIG. 9 is a front perspective view thereof.
Claims
The ornamental design for a light emitting diode package, as shown and described.
Type: Grant
Filed: Apr 25, 2003
Date of Patent: Jul 19, 2005
Assignee: Harvatek Corporation (Hsin-Chu)
Inventors: Bily Wang (Hsin-Chu), Jonnie Chuang (Taipei)
Primary Examiner: Stella Reid
Assistant Examiner: Selina Sikder
Attorney: Rosenberg, Klein & Lee
Application Number: 29/180,484