Light emitting diode package
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A light emitting diode (LED) with two top electrodes is mounted on a first metal plate. One of the electrodes is wire-bonded to the first metal plate serving as one terminal of the LED. The other electrode of the LED is connected by wire-bonding to a second metal plate serving as a second terminal of the LED. The inner ends of the metal plates and the LED are imbedded in a transparent glue, leaving the outer ends of the metal plates for external connection. The transparent glue allows the light emitted from the LED to be radiated.
FIG. 1 is a top plan view of the light emitting diode package showing our new design;
FIG. 2 is a bottom plan view thereof;
FIG. 3 is a left side elevation view thereof;
FIG. 4 is a right side elevation view thereof; and,
FIG. 5 is a side elevation view thereof.
Claims
The ornamental design for a light emitting diode package, as shown and described.
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| 6777719 | August 17, 2004 | Fujii |
| 20040075100 | April 22, 2004 | Bogner et al. |
| 20040188697 | September 30, 2004 | Brunner et al. |
Type: Grant
Filed: Apr 8, 2003
Date of Patent: Sep 6, 2005
Assignee: Harvatek Corporation (Hsin-Chu)
Inventors: Bily Wang (Hsin-Chu), Jonnie Chuang (Taipei), Yann Lee (Hsinchu)
Primary Examiner: Stella Reid
Assistant Examiner: Selina Sikder
Attorney: Rosenberg, Klein & Lee
Application Number: 29/179,243
