Electronic component cooling apparatus
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FIG. 1 is a front elevation view of a first embodiment of an electronic component cooling apparatus showing our new design;
FIG. 2 is a rear elevation view of the first embodiment of the cooling apparatus;
FIG. 3 is a right side elevation view of the first embodiment of the cooling apparatus;
FIG. 4 is a left side elevation view of the first embodiment of the cooling apparatus;
FIG. 5 is a top plan view of the first embodiment of the cooling apparatus;
FIG. 6 is a bottom plan view of the first embodiment of the cooling apparatus;
FIG. 7 is a top plan reference view of the first embodiment of the cooling apparatus;
FIG. 8 is a longitudinal cross sectional view of the first embodiment of the cooling apparatus;
FIG. 9 is a perspective view of the first embodiment of the cooling apparatus;
FIG. 10 is a front elevation view of a second embodiment of an electronic component cooling apparatus showing our new design;
FIG. 11 is a rear elevation view of the second embodiment of the cooling apparatus;
FIG. 12 is a right side elevation view of the second embodiment of the cooling apparatus;
FIG. 13 is a left side elevation view of the second embodiment of the cooling apparatus;
FIG. 14 is a top plan view of the second embodiment of the cooling apparatus;
FIG. 15 is a bottom plan view of the second embodiment of the cooling apparatus;
FIG. 16 is a top plan reference view of the second embodiment of the cooling apparatus;
FIG. 17 is a longitudinal cross sectional view of the second embodiment of the cooling apparatus taken along line 17—17 in FIG. 16; and,
FIG. 18 is a perspective view of the third embodiment of the cooling apparatus.
Claims
The ornamental design for an electronic component cooling apparatus, as shown and described.
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Type: Grant
Filed: Nov 10, 2004
Date of Patent: Apr 24, 2007
Assignee: Sanyo Denki Co., Ltd. (Tokyo)
Inventors: Michinori Watanabe (Nagano), Toshiki Ogawara (Nagano), Haruhisa Maruyama (Nagano)
Primary Examiner: Lisa Lichtenstein
Attorney: Rankin, Hill, Porter & Clark LLP
Application Number: 29/216,926
