Heat sink
Latest Thermaltake Technology Co., Ltd. Patents:
Description
Claims
The ornamental design for a heat sink, as shown and described.
Referenced Cited
U.S. Patent Documents
D480692 | October 14, 2003 | Lee |
6883592 | April 26, 2005 | Lee |
D541757 | May 1, 2007 | Lee |
20020182068 | December 5, 2002 | Liu |
20050067144 | March 31, 2005 | Chou |
20060061970 | March 23, 2006 | Lee |
20060082972 | April 20, 2006 | Kim |
20060137861 | June 29, 2006 | Wang et al. |
Patent History
Patent number: D561711
Type: Grant
Filed: Jan 4, 2007
Date of Patent: Feb 12, 2008
Assignee: Thermaltake Technology Co., Ltd.
Inventor: Pei-Hsi Lin (Sijhih)
Primary Examiner: Selina Sikder
Attorney: Schmeiser, Olsen & Watts
Application Number: 29/275,687
Type: Grant
Filed: Jan 4, 2007
Date of Patent: Feb 12, 2008
Assignee: Thermaltake Technology Co., Ltd.
Inventor: Pei-Hsi Lin (Sijhih)
Primary Examiner: Selina Sikder
Attorney: Schmeiser, Olsen & Watts
Application Number: 29/275,687
Classifications
Current U.S. Class:
Heat Sink (D13/179)