Heat sink

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Description

FIG. 1 is a perspective view of a heat sink;

FIG. 2 is a front elevation thereof;

FIG. 3 is a rear elevation thereof;

FIG. 4 is a left side elevation thereof;

FIG. 5 is a right side elevation thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom view thereof.

Claims

The ornamental design for a heat sink, as shown and described.

Referenced Cited
U.S. Patent Documents
D480692 October 14, 2003 Lee
6883592 April 26, 2005 Lee
D541757 May 1, 2007 Lee
20020182068 December 5, 2002 Liu
20050067144 March 31, 2005 Chou
20060061970 March 23, 2006 Lee
20060082972 April 20, 2006 Kim
20060137861 June 29, 2006 Wang et al.
Patent History
Patent number: D561711
Type: Grant
Filed: Jan 4, 2007
Date of Patent: Feb 12, 2008
Assignee: Thermaltake Technology Co., Ltd.
Inventor: Pei-Hsi Lin (Sijhih)
Primary Examiner: Selina Sikder
Attorney: Schmeiser, Olsen & Watts
Application Number: 29/275,687
Classifications
Current U.S. Class: Heat Sink (D13/179)