Electronic component cooling apparatus
Latest Sanyo Denki Co., Ltd. Patents:
Description
Claims
The ornamental design for an electronic component cooling apparatus, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
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D501450 | February 1, 2005 | Watanabe et al. |
D516526 | March 7, 2006 | Watanabe et al. |
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Patent History
Patent number: D563910
Type: Grant
Filed: Oct 25, 2006
Date of Patent: Mar 11, 2008
Assignee: Sanyo Denki Co., Ltd. (Tokyo)
Inventors: Michinori Watanabe (Nagano), Toshiki Ogawara (Nagano), Haruhisa Maruyama (Nagano)
Primary Examiner: Lisa Lichtenstein
Attorney: Rankin, Hill & Clark LLP
Application Number: 29/249,884
Type: Grant
Filed: Oct 25, 2006
Date of Patent: Mar 11, 2008
Assignee: Sanyo Denki Co., Ltd. (Tokyo)
Inventors: Michinori Watanabe (Nagano), Toshiki Ogawara (Nagano), Haruhisa Maruyama (Nagano)
Primary Examiner: Lisa Lichtenstein
Attorney: Rankin, Hill & Clark LLP
Application Number: 29/249,884
Classifications
Current U.S. Class:
Heat Sink (D13/179)