Semiconductor wafer delivery apparatus

- Tokyo Electron Limited
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Description

FIG. 1 is a front elevational view of a semiconductor wafer delivery apparatus, showing my design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a cross-sectional view taken along line 7—7 in FIG. 5;

FIG. 8 is a top and right front perspective view thereof; and,

FIG. 9 is a top and left rear perspective view thereof.

The broken lines represent unclaimed subject matter.

Claims

The ornamental design for a semiconductor wafer delivery apparatus, as shown and described.

Referenced Cited
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Patent History
Patent number: D568837
Type: Grant
Filed: Nov 14, 2005
Date of Patent: May 13, 2008
Assignee: Tokyo Electron Limited (Tokyo)
Inventor: Hiroki Hosaka (Nirasaki)
Primary Examiner: Selina Sikder
Attorney: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
Application Number: 29/242,547