Semiconductor wafer delivery apparatus

- Tokyo Electron Limited
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Description

FIG. 1 is a front elevational view of a semiconductor wafer delivery apparatus, showing my design;

FIG. 2 is a rear elevational view thereof;

FIG. 3 is a left side elevational view thereof;

FIG. 4 is a right side elevational view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a cross-sectional view taken along line 7—7 in FIG. 1;

FIG. 8 is a top and right front perspective view thereof; and,

FIG. 9 is a top and right rear perspective view thereof.

The broken line showing and the indicia shown in the Figures are shown for illustrative purposes only and form no part of the claimed design.

Claims

The ornamental design for a semiconductor wafer delivery apparatus, as shown and described.

Referenced Cited
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Patent History
Patent number: D571740
Type: Grant
Filed: Nov 14, 2005
Date of Patent: Jun 24, 2008
Assignee: Tokyo Electron Limited (Tokyo)
Inventor: Hiroki Hosaka (Nirasaki)
Primary Examiner: Selina Sikder
Attorney: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
Application Number: 29/242,546