Heat dissipation assembly

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Description

FIG. 1 is a perspective view of a heat dissipation assembly showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a right side elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a top plan view thereof; and,

FIG. 6 is a bottom plan view thereof.

Claims

The ornamental design for a heat dissipation assembly, as shown.

Referenced Cited
U.S. Patent Documents
6189601 February 20, 2001 Goodman et al.
6883592 April 26, 2005 Lee
6967845 November 22, 2005 Chiang et al.
7011144 March 14, 2006 Zeighami et al.
7011147 March 14, 2006 Hung
D541232 April 24, 2007 Lee et al.
7284596 October 23, 2007 Larson
7289322 October 30, 2007 Chen et al.
D561711 February 12, 2008 Lin
20030024687 February 6, 2003 Cheng et al.
20060092613 May 4, 2006 Kao et al.
20080017349 January 24, 2008 Li et al.
Patent History
Patent number: D572669
Type: Grant
Filed: Sep 1, 2007
Date of Patent: Jul 8, 2008
Assignee: Asia Vital Components Co., Ltd. (Kaohsiung)
Inventor: Shih-Jie Jiang (Kaohsiung)
Primary Examiner: Selina Sikder
Application Number: 29/284,191
Classifications
Current U.S. Class: Heat Sink (D13/179)