Circuit module

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Description

FIG. 1 is a perspective view of the top, front and right side of a circuit module showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

The ornamental design for a circuit module, as shown.

Referenced Cited
U.S. Patent Documents
D354275 January 10, 1995 Siegel et al.
D556687 December 4, 2007 Miyamoto et al.
20030082441 May 1, 2003 Hovi et al.
20030170530 September 11, 2003 Nishimura et al.
20060263650 November 23, 2006 Haraguchi et al.
20070298287 December 27, 2007 Tajima et al.
20080008910 January 10, 2008 Koh
Patent History
Patent number: D573115
Type: Grant
Filed: Jun 26, 2006
Date of Patent: Jul 15, 2008
Assignee: Mitsumi Electric Co., Ltd. (Tokyo)
Inventors: Yoshiaki Miyamoto (Atsugi), Osamu Tajima (Atsugi)
Primary Examiner: Selina Sikder
Attorney: Sughrue Mion, PLLC
Application Number: 29/262,031