Circuit module
Latest Mitsumi Electric Co., Ltd. Patents:
Description
Claims
The ornamental design for a circuit module, as shown.
Referenced Cited
U.S. Patent Documents
D354275 | January 10, 1995 | Siegel et al. |
D556687 | December 4, 2007 | Miyamoto et al. |
20030082441 | May 1, 2003 | Hovi et al. |
20030170530 | September 11, 2003 | Nishimura et al. |
20060263650 | November 23, 2006 | Haraguchi et al. |
20070298287 | December 27, 2007 | Tajima et al. |
20080008910 | January 10, 2008 | Koh |
Patent History
Patent number: D573115
Type: Grant
Filed: Jun 26, 2006
Date of Patent: Jul 15, 2008
Assignee: Mitsumi Electric Co., Ltd. (Tokyo)
Inventors: Yoshiaki Miyamoto (Atsugi), Osamu Tajima (Atsugi)
Primary Examiner: Selina Sikder
Attorney: Sughrue Mion, PLLC
Application Number: 29/262,031
Type: Grant
Filed: Jun 26, 2006
Date of Patent: Jul 15, 2008
Assignee: Mitsumi Electric Co., Ltd. (Tokyo)
Inventors: Yoshiaki Miyamoto (Atsugi), Osamu Tajima (Atsugi)
Primary Examiner: Selina Sikder
Attorney: Sughrue Mion, PLLC
Application Number: 29/262,031
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)