Low-profile detachable integrated circuit module

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Description

FIG. 1 is a perspective view of the low-profile detachable integrated circuit module illustrating its cooperative relationship with a packaged integrated circuit. The broken line showing of the packaged integrated circuit is included for the purpose of illustrating an environmental element only and forms no part of the claimed design;

FIGS. 2 and 3 are opposing side elevation views of the detachable module;

FIG. 4 is an end elevation view of the detachable module from its end nearer the lockout key;

FIG. 5 is an end elevation view of the detachable module from its end opposite that from the lockout key;

FIG. 6 is a top plan view of the detachable module; and,

FIG. 7 is a bottom plan view of the detachable module.

Referenced Cited
U.S. Patent Documents
4521828 June 4, 1985 Fanning
4538124 August 27, 1985 Morrison
5113404 May 12, 1992 Gaebe et al.
Patent History
Patent number: D354275
Type: Grant
Filed: Apr 8, 1994
Date of Patent: Jan 10, 1995
Assignee: SGS-Thomson Microelectronics, Inc. (Carrollton, TX)
Inventors: Harry M. Siegel (Hurst, TX), Tom Q. Lao (Irving, TX), Krishnan Kelappan (Carrollton, TX), Michael J. Hundt (Double Oak, TX)
Primary Examiner: Wallace R. Burke
Assistant Examiner: J. Sincavage
Attorneys: Rodney M. Anderson, Lisa K. Jorgenson, Richard K. Robinson
Application Number: 0/21,052