Fan

- Nidec Corporation
Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a bottom plan view of a fan showing our new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a left side elevation view thereof;

FIG. 4 is a right side elevation view thereof;

FIG. 5 is a front elevation view thereof;

FIG. 6 is a rear elevation view thereof;

FIG. 7 is a perspective view thereof;

FIG. 8 is a reference bottom plan view

FIG. 9 is a reference top plan view thereof;

FIG. 10 is a reference left side elevation view thereof;

FIG. 11 is a reference right side elevation view thereof;

FIG. 12 is a reference front elevation view thereof;

FIG. 13 is a reference rear elevation view thereof; and,

FIG. 14 is a reference perspective view thereof.

The lead wires are shown broken away in FIGS. 3–6 to indicate indeterminate length, it being understood that the wires have uniform shape and appearance through their length.

The broken lines in FIGS. 8–14 represent unclaimed subject matter.

Claims

The ornamental design for a fan, as shown and described.

Referenced Cited
U.S. Patent Documents
5519574 May 21, 1996 Kodama et al.
6407919 June 18, 2002 Chou
6411510 June 25, 2002 Sasa et al.
D465771 November 19, 2002 Hsieh
6480383 November 12, 2002 Kodaira et al.
D494548 August 17, 2004 Tsai et al.
D501450 February 1, 2005 Watanabe et al.
D509485 September 13, 2005 Mochizuki et al.
7221567 May 22, 2007 Otsuki et al.
20020182068 December 5, 2002 Liu
20050141992 June 30, 2005 Lin
20050271506 December 8, 2005 Pan
20050280992 December 22, 2005 Carter et al.
20060219386 October 5, 2006 Hsia et al.
Foreign Patent Documents
D1188537 October 2003 JP
D1188538 October 2003 JP
D1205085 May 2004 JP
D1222196 November 2004 JP
D1222480 November 2004 JP
D1237688 April 2005 JP
D1237951 April 2005 JP
D1237952 April 2005 JP
D1237953 April 2005 JP
D267913 January 1996 TW
D108000 November 2005 TW
D118994 September 2007 TW
Other references
  • Translation of the official communication issued in the counterpart Japanese Application No. 2006-008877, mailed on Oct. 13, 2006.
  • Translation of the official communication issued in the counterpart Japanese Application No. 2006-008877, mailed on Jun. 1, 2007.
  • Translation of the official communication issued in the counterpart Taiwanese Application No. 095305088, mailed on Jun. 23, 2007.
  • “Weekly Ascii”, Jun. 22, 2004, vol. 494, p. 156, published by ASCII CORPORATION, received by National Center for Industrial Property Information and Training on Jun. 8, 2004.
Patent History
Patent number: D575242
Type: Grant
Filed: Oct 4, 2006
Date of Patent: Aug 19, 2008
Assignee: Nidec Corporation (Kyoto)
Inventors: Takaya Otsuki (Kyoto), Takamasa Yamashita (Kyoto)
Primary Examiner: Selina Sikder
Attorney: Keating & Bennett, LLP
Application Number: 29/249,373
Classifications
Current U.S. Class: Heat Sink (D13/179)