Electrolytic plating anode

- Ebara Corporation
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Description

The claimed electrolytic plating anode is used to perform an electrolytic plating process in a plating bath when a voltage is applied via an anode shaft connected to the electrolytic plating anode.

FIG. 1 is a front elevation view of an electrolytic plating anode;

FIG. 2 is a rear view of the electrolytic plating anode shown in FIG. 1;

FIG. 3 is a top plan view of the electrolytic plating anode shown in FIG. 1, wherein the broken lines form no part of the claimed design;

FIG. 4 is a bottom plan view of the electrolytic plating anode shown in FIG. 1;

FIG. 5 is a right side view of the electrolytic plating anode shown in FIG. 1; and,

FIG. 6 is a left side view of the electrolytic plating anode shown in FIG. 1.

Claims

The ornamental design for an electrolytic plating anode, as shown and described.

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Patent History
Patent number: D583779
Type: Grant
Filed: Jul 13, 2006
Date of Patent: Dec 30, 2008
Assignee: Ebara Corporation (Tokyo)
Inventors: Fumio Kuriyama (Tokyo), Masaaki Kimura (Tokyo)
Primary Examiner: Selina Sikder
Attorney: Wenderoth, Lind & Ponack, L.L.P.
Application Number: 29/262,881