Heat dissipation device

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Description

FIG. 1 is a top, front and right side perspective view of a heat dissipation device showing our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

The ornamental design for a heat dissipation device, as shown and described.

Referenced Cited
U.S. Patent Documents
D449587 October 23, 2001 Cronin
D450044 November 6, 2001 Lindstrom
7215549 May 8, 2007 Kim
7227752 June 5, 2007 Xia et al.
20030188848 October 9, 2003 Kuo
20060289147 December 28, 2006 Zuo et al.
20070215321 September 20, 2007 Yang et al.
20080093052 April 24, 2008 Yang et al.
Patent History
Patent number: D586763
Type: Grant
Filed: Dec 5, 2007
Date of Patent: Feb 17, 2009
Assignee: Hon Hai Precision Industry Co., Ltd. (Tu-Cheng, Taipei Hsien)
Inventors: Yi-Tao Hua (Shenzhen), Wu-Yung Chen (Taipei Hsien), Chung-Yuan Chen (Taipei Hsien)
Primary Examiner: Selina Sikder
Attorney: Frank R. Niranjan
Application Number: 29/298,474
Classifications
Current U.S. Class: Heat Sink (D13/179)