Heat dissipation device
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Description
Claims
The ornamental design for a heat dissipation device, as shown and described.
Referenced Cited
U.S. Patent Documents
D449587 | October 23, 2001 | Cronin |
D450044 | November 6, 2001 | Lindstrom |
7215549 | May 8, 2007 | Kim |
7227752 | June 5, 2007 | Xia et al. |
20030188848 | October 9, 2003 | Kuo |
20060289147 | December 28, 2006 | Zuo et al. |
20070215321 | September 20, 2007 | Yang et al. |
20080093052 | April 24, 2008 | Yang et al. |
Patent History
Patent number: D586763
Type: Grant
Filed: Dec 5, 2007
Date of Patent: Feb 17, 2009
Assignee: Hon Hai Precision Industry Co., Ltd. (Tu-Cheng, Taipei Hsien)
Inventors: Yi-Tao Hua (Shenzhen), Wu-Yung Chen (Taipei Hsien), Chung-Yuan Chen (Taipei Hsien)
Primary Examiner: Selina Sikder
Attorney: Frank R. Niranjan
Application Number: 29/298,474
Type: Grant
Filed: Dec 5, 2007
Date of Patent: Feb 17, 2009
Assignee: Hon Hai Precision Industry Co., Ltd. (Tu-Cheng, Taipei Hsien)
Inventors: Yi-Tao Hua (Shenzhen), Wu-Yung Chen (Taipei Hsien), Chung-Yuan Chen (Taipei Hsien)
Primary Examiner: Selina Sikder
Attorney: Frank R. Niranjan
Application Number: 29/298,474
Classifications
Current U.S. Class:
Heat Sink (D13/179)