Wafer holding member
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Description
Claims
The ornamental design for a wafer holding member, as shown and described.
Referenced Cited
U.S. Patent Documents
5643366 | July 1, 1997 | Somekh et al. |
6183183 | February 6, 2001 | Goodwin et al. |
6190114 | February 20, 2001 | Ogawa et al. |
6190460 | February 20, 2001 | Hwang |
6405610 | June 18, 2002 | Komatsu et al. |
D559805 | January 15, 2008 | Hosaka |
20010051088 | December 13, 2001 | Park et al. |
20030169916 | September 11, 2003 | Hayashi et al. |
20060120833 | June 8, 2006 | Bonora et al. |
Patent History
Patent number: D589474
Type: Grant
Filed: Dec 6, 2007
Date of Patent: Mar 31, 2009
Assignee: Tokyo Electron Limited (Tokyo)
Inventors: Ikuo Ogasawara (Nirasaki), Munetoshi Nagasaka (Nirasaki)
Primary Examiner: Selina Sikder
Attorney: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
Application Number: 29/298,522
Type: Grant
Filed: Dec 6, 2007
Date of Patent: Mar 31, 2009
Assignee: Tokyo Electron Limited (Tokyo)
Inventors: Ikuo Ogasawara (Nirasaki), Munetoshi Nagasaka (Nirasaki)
Primary Examiner: Selina Sikder
Attorney: Oblon, Spivak, McClelland, Maier & Neustadt, P.C.
Application Number: 29/298,522
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)