Wafer carrier

- Hiwin Mikrosystem Corp.
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Description

FIG. 1 is a perspective view of a wafer carrier showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view to that shown.

The broken line showing portion of the wafer carrier is for illustrative purposes only and forms no part of the claimed design.

Claims

The ornamental design for a wafer carrier, as shown and described.

Referenced Cited
U.S. Patent Documents
5909994 June 8, 1999 Blum et al.
6132160 October 17, 2000 Iwai
6777964 August 17, 2004 Navratil et al.
D571740 June 24, 2008 Hosaka
7420381 September 2, 2008 Burcham et al.
20040100297 May 27, 2004 Tanioka et al.
20080236755 October 2, 2008 Kondoh et al.
Patent History
Patent number: D594424
Type: Grant
Filed: Jul 12, 2007
Date of Patent: Jun 16, 2009
Assignee: Hiwin Mikrosystem Corp. (Taichung)
Inventors: Cheng-Feng Lin (Taichung), Tsang-Chou Lee (Taichung)
Primary Examiner: Selina Sikder
Attorney: Banger Shia
Application Number: 29/282,117