Wafer carrier
Latest Hiwin Mikrosystem Corp. Patents:
Description
The broken line showing portion of the wafer carrier is for illustrative purposes only and forms no part of the claimed design.
Claims
The ornamental design for a wafer carrier, as shown and described.
Referenced Cited
U.S. Patent Documents
5909994 | June 8, 1999 | Blum et al. |
6132160 | October 17, 2000 | Iwai |
6777964 | August 17, 2004 | Navratil et al. |
D571740 | June 24, 2008 | Hosaka |
7420381 | September 2, 2008 | Burcham et al. |
20040100297 | May 27, 2004 | Tanioka et al. |
20080236755 | October 2, 2008 | Kondoh et al. |
Patent History
Patent number: D594424
Type: Grant
Filed: Jul 12, 2007
Date of Patent: Jun 16, 2009
Assignee: Hiwin Mikrosystem Corp. (Taichung)
Inventors: Cheng-Feng Lin (Taichung), Tsang-Chou Lee (Taichung)
Primary Examiner: Selina Sikder
Attorney: Banger Shia
Application Number: 29/282,117
Type: Grant
Filed: Jul 12, 2007
Date of Patent: Jun 16, 2009
Assignee: Hiwin Mikrosystem Corp. (Taichung)
Inventors: Cheng-Feng Lin (Taichung), Tsang-Chou Lee (Taichung)
Primary Examiner: Selina Sikder
Attorney: Banger Shia
Application Number: 29/282,117
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)