Light emitting diode
Latest Nichia Corporation Patents:
- METHOD OF MANUFACTURING METAL STRUCTURE FOR OPTICAL SEMICONDUCTOR DEVICE, PACKAGE, AND SOLUTION CONTAINING POLYALLYLAMINE POLYMER
- LASER WELDING METHOD, LASER WELDING SYSTEM, AND METAL JOINT
- Light-emitting device and method of manufacturing the same
- Light emitting device, headlight, and vehicle comprising same
- LIGHT SOURCE DEVICE AND DISPLAY DEVICE
The broken line showing of environment (the remaining structure of the light emitting diode) in
The opaque line shading illustrates a translucent portion of the light emitting diode through which the environment shown in the broken lines may be visible as illustrated in
Claims
The ornamental design for a light emitting diode, as shown and described.
| 6376902 | April 23, 2002 | Arndt |
| D471166 | March 4, 2003 | Oshio et al. |
| 6586721 | July 1, 2003 | Estevez-Garcia |
| D486801 | February 17, 2004 | Suenaga |
| D491899 | June 22, 2004 | Yagi |
| D505398 | May 24, 2005 | Nakashima |
| D512029 | November 29, 2005 | Kim et al. |
| D551180 | September 18, 2007 | Song et al. |
| D573113 | July 15, 2008 | Bando |
| D573114 | July 15, 2008 | Bando |
| D580381 | November 11, 2008 | Bando |
| D592617 | May 19, 2009 | Bando |
| 20040041222 | March 4, 2004 | Loh |
| 20040126913 | July 1, 2004 | Loh |
| 20050127816 | June 16, 2005 | Sumitani |
Type: Grant
Filed: Mar 12, 2009
Date of Patent: Aug 18, 2009
Assignee: Nichia Corporation (Anan-shi)
Inventor: Yoshitaka Bando (Tokushima)
Primary Examiner: Selina Sikder
Attorney: Global IP Counselors, LLP
Application Number: 29/333,645