Thermal insulation sleeve for a tea pot

- Pi-Design AG
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Description

FIG. 1 is a perspective view of the thermal insulation sleeve for a tea pot;

FIG. 2 is a first side elevation view thereof;

FIG. 3 is a second side elevation view thereof;

FIG. 4 is a third side elevation view thereof;

FIG. 5 is a fourth side elevation view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof;

FIG. 8 is a perspective view in an open state thereof; and,

FIG. 9 is a perspective view in use thereof.

The broken lines are for illustrative purposes only and form no part of the claimed design.

Claims

The ornamental design for a thermal insulation sleeve for a tea pot, as shown and described.

Referenced Cited
U.S. Patent Documents
4393975 July 19, 1983 Moore
4989418 February 5, 1991 Hewlett
5299433 April 5, 1994 Harms et al.
5934100 August 10, 1999 Hornick
6128915 October 10, 2000 Wagner
6276164 August 21, 2001 Santa Cruz et al.
20050126208 June 16, 2005 Yang
Patent History
Patent number: D605900
Type: Grant
Filed: Apr 21, 2009
Date of Patent: Dec 15, 2009
Assignee: Pi-Design AG (Triengen)
Inventor: Jorgen Bodum (Meggen)
Primary Examiner: Terry A Wallace
Attorney: Sughrue Mion, PLLC
Application Number: 29/335,759
Classifications
Current U.S. Class: D7/607; D7/387; D7/624.2