Housing of a light emitting diode package

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Description

FIG. 1 is a perspective view of a housing of a light emitting diode package showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof wherein the broken line showing portion of the diode package is for illustrative purpose only and forms no part of the claimed design;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof; and,

FIG. 6 is a top view thereof, the bottom view being a mirror image of the top side view.

Claims

The ornamental design for a housing of a light emitting diode package, as shown and described.

Referenced Cited
U.S. Patent Documents
D528999 September 26, 2006 Cho et al.
D537798 March 6, 2007 Shin et al.
D558156 December 25, 2007 Yoon et al.
D578491 October 14, 2008 Lee et al.
D593515 June 2, 2009 Nakagawa
D602447 October 20, 2009 Sheng et al.
Patent History
Patent number: D616386
Type: Grant
Filed: Aug 6, 2009
Date of Patent: May 25, 2010
Assignee: Everlight Electronics Co., Ltd. (Taipei)
Inventors: Chung-Han Sheng (Taipei), Yi-Wen Chen (Taipei)
Primary Examiner: Selina Sikder
Attorney: Jianq Chyun IP Office
Application Number: 29/341,474
Classifications
Current U.S. Class: Electron Or Vacuum Tube (23) (D13/180)