Pedestal of heat insulating cylinder for manufacturing semiconductor wafers

Description

FIG. 1 is front perspective view of a pedestal of heat insulating cylinder for manufacturing semiconductor wafers illustrating my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a cross-sectional view taken through line 8—8 of FIG. 2;

FIG. 9 is a cross-sectional view taken through line 9—9 of FIG. 2; and,

FIG. 10 is a front perspective view of a pedestal of heat insulating cylinder for manufacturing semiconductor wafers in use.

The broken lines are shown for illustrative purposes only and form no part of the claimed design.

Claims

The ornamental design for a pedestal of heat insulating cylinder for manufacturing semiconductor wafers, as shown and described.