Pedestal of heat insulating cylinder for manufacturing semiconductor wafers

- Tokyo Electron Limited
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Description

FIG. 1 is front perspective view of a pedestal of heat insulating cylinder for manufacturing semiconductor wafers illustrating my new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is a cross-sectional view taken through line 8—8 of FIG. 2;

FIG. 9 is a cross-sectional view taken through line 9—9 of FIG. 2; and,

FIG. 10 is a front perspective view of a pedestal of heat insulating cylinder for manufacturing semiconductor wafers in use.

The broken lines are shown for illustrative purposes only and form no part of the claimed design.

Claims

The ornamental design for a pedestal of heat insulating cylinder for manufacturing semiconductor wafers, as shown and described.

Referenced Cited
U.S. Patent Documents
4872554 October 10, 1989 Quernemoen
5897311 April 27, 1999 Nishi
D409158 May 4, 1999 Shimazu
6099645 August 8, 2000 Easley et al.
6110285 August 29, 2000 Kitazawa et al.
6488497 December 3, 2002 Buckley et al.
7033168 April 25, 2006 Gupta et al.
7484958 February 3, 2009 Kobayashi
7501370 March 10, 2009 Narendar et al.
Patent History
Patent number: D616396
Type: Grant
Filed: Sep 2, 2009
Date of Patent: May 25, 2010
Assignee: Tokyo Electron Limited (Minato-Ku)
Inventor: Izumi Sato (Oshu)
Primary Examiner: Selina Sikder
Attorney: Burr & Brown
Application Number: 29/342,858