Light emitting diode package device

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Description

FIG. 1 is a front view of a light emitting diode package device with the new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a left side view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a top plan view thereof, wherein a metal element is disposed on the bottom of the LED package;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a perspective view thereof; and,

FIG. 8 is a sectional view thereof taken along line 88 in FIG. 5.

Claims

The ornamental design for a light emitting diode package device, as shown and described.

Referenced Cited
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Foreign Patent Documents
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Patent History
Patent number: D622677
Type: Grant
Filed: May 19, 2009
Date of Patent: Aug 31, 2010
Assignee: Everlight Electronics Co., Ltd. (Tucheng, Taipei Hsien)
Inventor: Chung-Chuan Hsieh (Taipei Hsien)
Primary Examiner: Selina Sikder
Attorney: Winston Hsu
Application Number: 29/337,278
Classifications