Light emitting diode package device

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Description

FIG. 1 is a front view of a light emitting diode package device with the new design, having a Fresnel lens with circular patterns;

FIG. 2 is a rear view thereof;

FIG. 3 is a left side view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a perspective view thereof; and,

FIG. 8 is a perspective view of bottom side thereof.

The cross sectional views shown in FIG. 8 is included for the purpose of showing external surface contours which may not be clear from the remaining illustrations. Any features of internal construction shown are incidental and form no part of the claimed design.

Claims

The ornamental design for an light emitting diode package device, as shown and described.

Referenced Cited
U.S. Patent Documents
5623181 April 22, 1997 Suehiro et al.
6610563 August 26, 2003 Waitl et al.
D503690 April 5, 2005 Kamada
D523826 June 27, 2006 Kamada
D528997 September 26, 2006 Jung
D568832 May 13, 2008 Kang et al.
D570798 June 10, 2008 Shih
Foreign Patent Documents
D1323249 February 2008 JP
300458416 August 2007 KR
300484795 March 2008 KR
D114618 December 2006 TW
D119728 November 2007 TW
Patent History
Patent number: D622679
Type: Grant
Filed: Jul 22, 2009
Date of Patent: Aug 31, 2010
Assignee: Everlight Electronics Co., Ltd. (Tucheng, Taipei Hsien)
Inventor: Chung-Chuan Hsieh (Taipei Hsien)
Primary Examiner: Selina Sikder
Attorney: Winston Hsu
Application Number: 29/340,658
Classifications