Light emitting diode package device
Latest Everlight Electronics Co., Ltd. Patents:
Description
The cross sectional views shown in
Claims
The ornamental design for an light emitting diode package device, as shown and described.
Referenced Cited
U.S. Patent Documents
Foreign Patent Documents
5623181 | April 22, 1997 | Suehiro et al. |
6610563 | August 26, 2003 | Waitl et al. |
D503690 | April 5, 2005 | Kamada |
D523826 | June 27, 2006 | Kamada |
D528997 | September 26, 2006 | Jung |
D568832 | May 13, 2008 | Kang et al. |
D570798 | June 10, 2008 | Shih |
D1323249 | February 2008 | JP |
300458416 | August 2007 | KR |
300484795 | March 2008 | KR |
D114618 | December 2006 | TW |
D119728 | November 2007 | TW |
Patent History
Patent number: D622679
Type: Grant
Filed: Jul 22, 2009
Date of Patent: Aug 31, 2010
Assignee: Everlight Electronics Co., Ltd. (Tucheng, Taipei Hsien)
Inventor: Chung-Chuan Hsieh (Taipei Hsien)
Primary Examiner: Selina Sikder
Attorney: Winston Hsu
Application Number: 29/340,658
Type: Grant
Filed: Jul 22, 2009
Date of Patent: Aug 31, 2010
Assignee: Everlight Electronics Co., Ltd. (Tucheng, Taipei Hsien)
Inventor: Chung-Chuan Hsieh (Taipei Hsien)
Primary Examiner: Selina Sikder
Attorney: Winston Hsu
Application Number: 29/340,658
Classifications
Current U.S. Class:
Electron Or Vacuum Tube (23) (D13/180)