Light emitting diode package device

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Description

FIG. 1 is a front view of a light emitting diode package device with the new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a left side view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a top plan view thereof;

FIG. 6 is a bottom plan view thereof;

FIG. 7 is a perspective view thereof; and,

FIG. 8 is a perspective view of bottom side thereof.

Claims

The ornamental design for a light emitting diode package device, as shown and described.

Referenced Cited
U.S. Patent Documents
D490387 May 25, 2004 Yagi
D494550 August 17, 2004 Hoshiba
D495304 August 31, 2004 Kim et al.
D547736 July 31, 2007 Kamada
D584246 January 6, 2009 Low et al.
7524087 April 28, 2009 Aizar et al.
D595674 July 7, 2009 Wang et al.
D596591 July 21, 2009 In et al.
D597971 August 11, 2009 Kobayakawa et al.
Foreign Patent Documents
300432976 December 2006 KR
531277 May 2003 TW
584490 April 2004 TW
584491 April 2004 TW
584492 April 2004 TW
Patent History
Patent number: D623150
Type: Grant
Filed: Jun 25, 2009
Date of Patent: Sep 7, 2010
Assignee: Everlight Electronics Co., Ltd. (Tucheng, Taipei Hsien)
Inventor: Chung-Chuan Hsieh (Taipei Hsien)
Primary Examiner: Selina Sikder
Attorney: Winston Hsu
Application Number: 29/339,195
Classifications
Current U.S. Class: Electron Or Vacuum Tube (23) (D13/180)