High-power light emitting diode chip

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Description

FIG. 1 is a perspective view of a high-power light emitting diode chip showing our new design;

FIG. 2 is a front side view of the embodiment shown in FIG. 1;

FIG. 3 is a back side view of the embodiment shown in FIG. 1;

FIG. 4 is a left side view of the embodiment shown in FIG. 1;

FIG. 5 is a right side view of the embodiment shown in FIG. 1;

FIG. 6 is a top view of the embodiment shown in FIG. 1; and,

FIG. 7 is a bottom view of the embodiment shown in FIG. 1.

Claims

The ornamental design for a high-power light emitting diode chip, as shown and described.

Referenced Cited
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Patent History
Patent number: D638377
Type: Grant
Filed: Mar 23, 2010
Date of Patent: May 24, 2011
Inventors: Liang-Jyi Yan (Daya Township), Yea-Chen Lee (Daya Township), Chih-Sung Chang (Daya Township)
Primary Examiner: Selina Sikder
Application Number: 29/358,105
Classifications
Current U.S. Class: Electron Or Vacuum Tube (23) (D13/180)