Light emitting diode package

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Description

FIG. 1 is a perspective view of a light emitting diode package in accordance with the new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

I claim the ornamental design for a light emitting diode package, as shown and described.

Referenced Cited
U.S. Patent Documents
6777719 August 17, 2004 Fujii
D511328 November 8, 2005 Wang
7049639 May 23, 2006 Wang
D576571 September 9, 2008 Itai
D590356 April 14, 2009 Takano
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D599303 September 1, 2009 Seo
7731405 June 8, 2010 Ishizaka et al.
D619977 July 20, 2010 Ni et al.
D630171 January 4, 2011 Hsieh
D631021 January 18, 2011 Ni et al.
20060113906 June 1, 2006 Ogawa
20060214273 September 28, 2006 Wang
20100072502 March 25, 2010 Kadotani
Foreign Patent Documents
1066550-004 April 2000 JP
D1078478 April 2000 JP
D1170881 February 2003 JP
D1322677 January 2008 JP
3001652910000 June 1995 KR
D130663 September 2009 TW
Other references
  • Ni, “Light Emitting Diode Package”, Pending U.S. Appl. No. 29/358,359, filed Mar. 26, 2010.
Patent History
Patent number: D640644
Type: Grant
Filed: Sep 17, 2010
Date of Patent: Jun 28, 2011
Assignee: Everlight Electronics Co., Ltd. (Tucheng Dist., New Taipei)
Inventor: Wen-Chieh Tsou (Taipei Hsien)
Primary Examiner: Selina Sikder
Attorney: Winston Hsu
Application Number: 29/375,076
Classifications
Current U.S. Class: Electron Or Vacuum Tube (23) (D13/180)