Light emitting diode package

- Lextar Electronics Corp.
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Description

FIG. 1 is a front perspective view of light emitting diode package showing the new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is another perspective view there of.

Claims

The ornamental design for light emitting diode package, as shown and described.

Referenced Cited
U.S. Patent Documents
D599304 September 1, 2009 Kim et al.
D601518 October 6, 2009 Lee et al.
D606032 December 15, 2009 Lee et al.
7847300 December 7, 2010 Kim et al.
D634283 March 15, 2011 Ko et al.
D637980 May 17, 2011 Ko et al.
7982235 July 19, 2011 Asakawa et al.
8013357 September 6, 2011 Park et al.
20110031525 February 10, 2011 Nemoto et al.
Patent History
Patent number: D653223
Type: Grant
Filed: Jun 30, 2011
Date of Patent: Jan 31, 2012
Assignee: Lextar Electronics Corp. (Hsinchu)
Inventor: Kun-Jung Wu (Kaohsiung)
Primary Examiner: Selina Sikder
Attorney: Schmeiser Olsen & Watts LLP
Application Number: 29/396,472
Classifications