Abstract: A plant illumination apparatus includes a light source module including a first light source and a second light source generating lights having different wavelengths, an environment-detecting module detecting an external environment to obtain a real-time environment parameter, and a control module connected to the light source module and the environment-detecting module. The control module includes a processor unit and a storage unit storing a database of plant growing environment parameters. The processor unit loads at least one preset growing environment parameter corresponding to a plant growth timing from the database of plant growing environment parameters, and compares the preset growing environment parameter with the real-time environment parameter to output at least one comparison result. The processor unit adjusts the first light source and the second light source according to the comparison result, so that an adjusted environment parameter matches the preset growing environment parameter.

Abstract: A light-emitting diode has a metal structure, a light-emitting chip, and a bowl structure. The metal structure has a platform and a heat sink. The platform has a top face, a first side, and a second side opposite to the first side. A first reflector and a second reflector respectively extend from the first side and the second side. The heat sink extends below the top face and has a drop from the bottom surfaces of the first reflector and the second reflector. The light-emitting chip is disposed on the top face. The bowl structure covers the outer surface of the metal structure and shields the bottom surfaces of the first reflector and the second reflector. A thermal dispassion surface of the heat sink is exposed from the bowl structure. An inner surface of bowl wall has a plurality of reflection structures to promote the light extraction efficiency.

Abstract: The present invention relates to a light emitted diode (LED). The LED includes a metal mirror, a bonding substrate, a distributed bragg reflector (DBR), a buffer layer, and a LED epitaxial structure. The bonding substrate is arranged under the metal mirror. The DBR is arranged on the metal mirror. The buffer layer is arranged on the DBR. The LED epitaxial structure is arranged on the buffer layer.

Abstract: A light source cooling device includes a light source module, an inner casing, an outer casing, and a plurality of spacers. The inner casing encloses an accommodation space for accommodating the light source module. The outer casing surrounds the inner casing and has a gap included between an inner wall of the inner casing and the outer casing, wherein the inner casing and the outer casing are made of materials with different thermal conductivity coefficients. The inner wall of the inner casing, an outer wall of the outer casing, and the spacers together form a plurality of heat-dissipating passages. The inner wall absorbs the heat generated by the light source module and generates a temperature gradient between the inner wall and the outer wall, which assists in creating thermal convection to exhaust the heat.

Abstract: A surface mount process, a surface mount system, and a feeding apparatus thereof are provided. The surface mount system includes a feeding apparatus and a surface mount apparatus. The feeding apparatus includes a vibrating tray feeder module, a vibrating linear feeder module, and a component recycling module. The vibrating tray feeder module has a circular vibrating conveyer belt with a vibrating tray output end. The vibrating linear feeder module has a linear vibrating conveyer belt connected to the vibrating tray output end and has a linear vibrating output end opposite the vibrating tray feeder module. The component recycling module is disposed under the vibrating tray feeder module to recycle the rejected components. The surface mount apparatus has a component receiving unit corresponding to the linear vibrating output end of the vibrating linear feeder module.

Abstract: A light emitting diode includes a casing, a frame in the casing, one or a plurality of light emitting chip, and a packaging polymer; the frame being provided 5 with a placement area to receive placement of the light emitting chip, and an electrode area separated from the placement area; a sectional fall being disposed at where appropriately on the placement area to increase contact area between the frame and the casing and improve the relative stability between the casing and the frame.

Abstract: An LED package including a lead-frame, at least an LED chip and an encapsulant is provided. The lead-frame has a roughened surface, the LED chip is disposed on the lead-frame and electrically connected to the lead-frame, and the roughened surface is suitable to scatter the light emitted from the LED chip. In addition, the encapsulant encapsulates the LED chip and a part of the lead-frame, and the rest part of the lead-frame is exposed out of the encapsulant.

Abstract: A wafer-level packaging process of a light-emitting diode is provided. First, a semiconductor stacked layer is formed on a growth substrate. A plurality of barrier patterns and a plurality of reflective layers are then formed on the semiconductor stacked layer, wherein each reflective layer is surrounded by one of the barrier patterns. A first bonding layer is then formed on the semiconductor stacked layer to cover the barrier patterns and the reflective layers. Thereafter, a carrying substrate having a plurality of second bonding layers and a plurality of conductive plugs electrically insulated from each other is provided, and the first bonding layer is bonded with the second bonding layer. The semiconductor stacked layer is then separated from the growth substrate. Next, the semiconductor stacked layer is patterned to form a plurality of semiconductor stacked patterns. Next, each semiconductor stacked pattern is electrically connected to the conductive plug.