Package of a light emitting diode

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Description

FIG. 1 is a perspective view of package of a light emitting diode showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a bottom perspective view; the portions shown in dashed lines do not form part of the design.

Claims

The ornamental design for package of a light emitting diode, as shown and described.

Referenced Cited
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Patent History
Patent number: D654032
Type: Grant
Filed: Jan 7, 2011
Date of Patent: Feb 14, 2012
Assignees: Silitek Electronic (Guangzhou) Co., Ltd. (Guangzhou), Lite-On Technology Corp. (Taipei)
Inventors: Chung-Hsien Yu (Taipei), Ming-Chuan Chang (Taipei)
Primary Examiner: Selina Sikder
Attorney: Rosenberg, Klein & Lee
Application Number: 29/382,822
Classifications