Solder dot for circuit board
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The solder dot is shown broken away in
The left side elevational view of one embodiment of the solder dot for circuit board is the same with a right side elevational view, a front elevational view, and a rear elevational view thereof, therefore, they are not shown. The left side elevational views of the another embodiments of the solder dot for circuit board are the same with a corresponding right side elevational view, a corresponding front elevational view, and a corresponding rear elevational view thereof, therefore, they are not shown. The broken lines showing are for illustrative purposes only and forms no part of the claimed design.
Claims
The ornamental design for a solder dot for circuit board, as shown and described.
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Type: Grant
Filed: Jul 29, 2010
Date of Patent: Jun 19, 2012
Assignee: Hon Hai Precision Industry Co., Ltd. (Tu-Cheng, New Taipei)
Inventors: Shu-Jen Tsai (Taipei Hsien), Long-Fong Chen (Taipei Hsien), Wen-Haw Tseng (Taipei Hsien), Shih-Fang Wong (Taipei Hsien)
Primary Examiner: Selina Sikder
Attorney: Altis Law Group, Inc.
Application Number: 29/366,691