Solder dot for circuit board

Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a perspective view of one embodiment of a solder dot for circuit board showing our new design;

FIG. 2 is a plan view thereof;

FIG. 3 is a left side elevational view thereof the right, front and rear elevation views being identical to the left side;

FIG. 4 is a perspective view of another embodiment of a solder dot for circuit board showing our new design;

FIG. 5 is a plan view thereof;

FIG. 6 is a left side elevational view thereof.

FIG. 7 is a perspective view of a solder dot for circuit board showing our new design shown in an alternate environment;

FIG. 8 is a plan view thereof;

FIG. 9 is a left side elevational view thereof the right, front and rear elevation views being identical to the left side.

FIG. 10 is a perspective view of a solder dot for circuit board showing our new design shown in an alternate environment;

FIG. 11 is a plan view thereof; and,

FIG. 12 is a left side elevational view thereof the right, front and rear elevation views being identical to the left side.

The solder dot is shown broken away in FIGS. 4, 6,10, and 12 of the drawing to indicated indeterminate length, it being understood that it has a uniform shape and appearance through its length.

The left side elevational view of one embodiment of the solder dot for circuit board is the same with a right side elevational view, a front elevational view, and a rear elevational view thereof, therefore, they are not shown. The left side elevational views of the another embodiments of the solder dot for circuit board are the same with a corresponding right side elevational view, a corresponding front elevational view, and a corresponding rear elevational view thereof, therefore, they are not shown. The broken lines showing are for illustrative purposes only and forms no part of the claimed design.

Claims

The ornamental design for a solder dot for circuit board, as shown and described.

Referenced Cited
U.S. Patent Documents
3163393 December 1964 Strong, Jr.
3785784 January 1974 Tezuka
4523883 June 18, 1985 Peterson et al.
5053850 October 1, 1991 Baker et al.
D365084 December 12, 1995 Suski et al.
5519580 May 21, 1996 Natarajan et al.
5750936 May 12, 1998 Wheatley et al.
6388203 May 14, 2002 Rinne et al.
7064449 June 20, 2006 Lin et al.
D580382 November 11, 2008 Ohsawa et al.
20020027017 March 7, 2002 Petri
20070247827 October 25, 2007 Lorenzen
20090004501 January 1, 2009 Tsai et al.
Patent History
Patent number: D662069
Type: Grant
Filed: Jul 29, 2010
Date of Patent: Jun 19, 2012
Assignee: Hon Hai Precision Industry Co., Ltd. (Tu-Cheng, New Taipei)
Inventors: Shu-Jen Tsai (Taipei Hsien), Long-Fong Chen (Taipei Hsien), Wen-Haw Tseng (Taipei Hsien), Shih-Fang Wong (Taipei Hsien)
Primary Examiner: Selina Sikder
Attorney: Altis Law Group, Inc.
Application Number: 29/366,691