Light emitting diode package

- Lextar Electronics Corp.
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Description

FIG. 1 is a front perspective view of light emitting diode package showing the new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

I claim the ornamental design for light emitting diode package, as shown and described.

Referenced Cited
U.S. Patent Documents
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D578084 October 7, 2008 Kobayakawa
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D628541 December 7, 2010 Lin
D632267 February 8, 2011 Chen et al.
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D640995 July 5, 2011 Lin et al.
D640996 July 5, 2011 Lee et al.
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Patent History
Patent number: D664107
Type: Grant
Filed: Sep 23, 2011
Date of Patent: Jul 24, 2012
Assignee: Lextar Electronics Corp. (Hsinchu)
Inventor: Chi-Kuon Wang (Taipei)
Primary Examiner: Selina Sikder
Attorney: Schmeiser, Olsen & Watts LLP
Application Number: 29/402,468
Classifications