Light emitting diode package

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Description

FIG. 1 is a front perspective view of light emitting diode package showing the new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

I claim the ornamental design for light emitting diode package, as shown and described.

Referenced Cited
U.S. Patent Documents
D576570 September 9, 2008 Chen et al.
D578084 October 7, 2008 Kobayakawa
D608309 January 19, 2010 Kim
D622682 August 31, 2010 Park et al.
D628541 December 7, 2010 Lin
D632267 February 8, 2011 Chen et al.
D635529 April 5, 2011 Hsu
D640995 July 5, 2011 Lin et al.
D640996 July 5, 2011 Lee et al.
D656107 March 20, 2012 Hsu
20110127566 June 2, 2011 Yoon
Patent History
Patent number: D664505
Type: Grant
Filed: Jul 25, 2011
Date of Patent: Jul 31, 2012
Assignee: Lextar Electronics Corp. (Hsinchu)
Inventor: Bo-Yu Ko (New Taipei)
Primary Examiner: Selina Sikder
Attorney: Schmeiser, Olsen & Watts LLP
Application Number: 29/398,010
Classifications
Current U.S. Class: Electron Or Vacuum Tube (23) (D13/180)