Patents by Inventor Bo-Yu Ko

Bo-Yu Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240322093
    Abstract: A light-emitting module is provided. The light-emitting module includes a substrate and n number of light-emitting elements disposed on the substrate. The n number of light-emitting elements have n?1 number of first intervals. The n?1 number of first intervals have a first standard deviation, wherein n is greater than or equal to 3. The light-emitting module further includes a light-shielding structure which is disposed on the n number of light-emitting elements and has n number of light-emitting holes. The n number of light-emitting holes correspond to the n number of light-emitting elements, respectively, and have n?1 number of second intervals. The n?1 number of second intervals have a second standard deviation, wherein the first standard deviation is greater than the second standard deviation.
    Type: Application
    Filed: March 20, 2024
    Publication date: September 26, 2024
    Inventors: Ya-Hsien CHANG, Wei-Chiang HU, Bo-Yu KO, Chieh-Chun CHANG, Tzu-Yuan LIN, Ching-Yi CHEN
  • Patent number: 10270020
    Abstract: An LED package structure includes a first metal plate, a second metal plate, and a mold. The first metal plate has at least one first protrusion portion. The second metal plate has at least one second protrusion portion. The mold is disposed on the first metal plate and the second metal plate, in which the mold has a first side surface, a second side surface opposite to the first side surface, a third side surface, and a fourth side surface opposite to the third side surface. The first and second protrusion portion protrude respectively from the first side surface and the second side surface, and the first metal plate and the second metal plate are covered by the third side surface and the fourth side surface, in which a portion of the first side surface between the first edge and the first protrusion portion is a fracture surface.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: April 23, 2019
    Assignee: LEXTAR ELECTRONICS CORPORATION
    Inventors: Dao-Wei Chen, Kun-Jung Wu, Bo-Yu Ko
  • Publication number: 20180366626
    Abstract: An LED package structure includes a first metal plate, a second metal plate, and a mold. The first metal plate has at least one first protrusion portion. The second metal plate has at least one second protrusion portion. The mold is disposed on the first metal plate and the second metal plate, in which the mold has a first side surface, a second side surface opposite to the first side surface, a third side surface, and a fourth side surface opposite to the third side surface. The first and second protrusion portion protrude respectively from the first side surface and the second side surface, and the first metal plate and the second metal plate are covered by the third side surface and the fourth side surface, in which a portion of the first side surface between the first edge and the first protrusion portion is a fracture surface.
    Type: Application
    Filed: June 20, 2017
    Publication date: December 20, 2018
    Inventors: Dao-Wei CHEN, Kun-Jung WU, Bo-Yu KO
  • Publication number: 20160082631
    Abstract: A mold for manufacturing an LED mounting substrate includes a first molding die and a second molding die, The second molding die covers the first molding die. The second molding die includes a material holding tank, a pressing part and a material inlet channel. The pressing part is protruded on the material holding tank. The pressing part expands along a direction from the first molding die to the second molding die. The material inlet channel is connected between an outer wall of the second molding die and the material holding tank. The material inlet channel shrinks along a direction from the first molding die to the second molding die.
    Type: Application
    Filed: December 2, 2015
    Publication date: March 24, 2016
    Inventors: Shing-Kuo Chen, Bo-Yu Ko, Hsiu-Hsiang Lin
  • Patent number: 9245877
    Abstract: A LED device is provided. The LED comprises a frame, a housing, a LED chip and a protection component. The frame comprises a first lead frame and a second lead frame disposed along a first direction and isolated from each other. The housing partially covers the first and second lead frames, and has a receiving portion exposing parts of the surfaces of the first and second lead frames. The LED chip is disposed in the receiving portion on the exposed surface of the first lead frame, and electrically connected to the first and second lead frames. The protection component is disposed on a surface of the second lead frame that is covered by the housing and electrically connected to the first lead frame. None of the sides of a vertical projection of the protection component on the second lead frame is parallel or perpendicular to the first direction.
    Type: Grant
    Filed: June 16, 2014
    Date of Patent: January 26, 2016
    Assignee: LEXTAR ELECTRONICS CORPORATION
    Inventors: Bo-Yu Ko, Yee-Cheng Chang, Chun-Wei Wang
  • Patent number: 9238317
    Abstract: An LED mounting substrate includes a lead frame, a base, and a residue of injection molding material. The base is placed on the lead frame, and includes a cavity. The bottom of the cavity includes an opening for exposing portion of the lead frame. The cross-sectional area of the cavity increases along the direction from the lead frame to the top surface of the base. The residue of injection molding material is remained on one of outer walls of the base surrounding the cavity. The cross-sectional area of the residue of injection molding material decreases along the direction from the lead frame to the top surface of the base.
    Type: Grant
    Filed: January 16, 2014
    Date of Patent: January 19, 2016
    Assignee: Lextar Electronics Corporation
    Inventors: Shing-Kuo Chen, Bo-Yu Ko, Hsiu-Hsiang Lin
  • Publication number: 20150207049
    Abstract: A LED device is provided. The LED comprises a frame, a housing, a LED chip and a protection component. The frame comprises a first lead frame and a second lead frame disposed along a first direction and isolated from each other. The housing partially covers the first and second lead frames, and has a receiving portion exposing parts of the surfaces of the first and second lead frames. The LED chip is disposed in the receiving portion on the exposed surface of the first lead frame, and electrically connected to the first and second lead frames. The protection component is disposed on a surface of the second lead frame that is covered by the housing and electrically connected to the first lead frame. None of the sides of a vertical projection of the protection component on the second lead frame is parallel or perpendicular to the first direction.
    Type: Application
    Filed: June 16, 2014
    Publication date: July 23, 2015
    Inventors: Bo-Yu Ko, Yee-Cheng Chang, Chun-Wei Wang
  • Publication number: 20140197446
    Abstract: An LED mounting substrate includes a lead frame, a base, and a residue of injection molding material. The base is placed on the lead frame, and includes a cavity. The bottom of the cavity includes an opening for exposing portion of the lead frame. The cross-sectional area of the cavity increases along the direction from the lead frame to the top surface of the base. The residue of injection molding material is remained on one of outer walls of the base surrounding the cavity. The cross-sectional area of the residue of injection molding material decreases along the direction from the lead frame to the top surface of the base.
    Type: Application
    Filed: January 16, 2014
    Publication date: July 17, 2014
    Applicant: Lextar Electronics Corporation
    Inventors: Shing-Kuo Chen, Bo-Yu Ko, Hsiu-Hsiang Lin
  • Publication number: 20130277706
    Abstract: A package structure of a light emitting device is disclosed. The package structure includes a light emitting device, a leadframe and a cup structure. The leadframe is used for supporting the light emitting device. The leadframe has a top surface, a bottom surface and a side surface located between the top surface and the bottom surface. The side surface has a dimension in the thickness direction of the leadframe. The cup structure made of thermosetting resin is disposed on the leadframe. A sidewall of the cup structure covers the side surface of the leadframe, and has a connecting profile length in the thickness direction with respect to the side surface. The connecting profile length is larger than the dimension of the side surface in the thickness direction.
    Type: Application
    Filed: April 1, 2013
    Publication date: October 24, 2013
    Applicant: Lextar Electronics Corporation
    Inventors: Shing-Kuo Chen, Bo-Yu Ko, Chun-Wei Wang
  • Publication number: 20130270602
    Abstract: The present invention provides an LED packaging structure comprising a leadframe, including: a first electrode including a first functional area and a first extension area extending from the first functional area: a second electrode including a second functional area and a second extension area extending from the second functional area, a cup-shaped insulator, wrapping the first and second electrodes, including an emitting concave formed at the inner side of the cup-shaped insulator and exposing the upper surfaces of the first and second functional areas, wherein portions of the first and second extension areas are exposed from the bottom of the outer side of the cup-shaped insulator; an interposed spacer physically separating the first and second electrodes; and an electroplating layer partially covering the surfaces of the first and second electrodes.
    Type: Application
    Filed: April 15, 2013
    Publication date: October 17, 2013
    Applicant: LEXTAR ELECTRONICS CORPORATION
    Inventors: Bo-Yu KO, Pu WANG, Chun Wei Wang
  • Patent number: D664505
    Type: Grant
    Filed: July 25, 2011
    Date of Patent: July 31, 2012
    Assignee: Lextar Electronics Corp.
    Inventor: Bo-Yu Ko
  • Patent number: D668624
    Type: Grant
    Filed: November 21, 2011
    Date of Patent: October 9, 2012
    Assignee: Lextar Electronics Corp.
    Inventor: Bo-Yu Ko
  • Patent number: D670663
    Type: Grant
    Filed: December 14, 2011
    Date of Patent: November 13, 2012
    Assignee: Lextar Electronics, Corp.
    Inventor: Bo-Yu Ko
  • Patent number: D675170
    Type: Grant
    Filed: December 14, 2011
    Date of Patent: January 29, 2013
    Assignee: Lextar Electronics Corp.
    Inventor: Bo-Yu Ko
  • Patent number: D678225
    Type: Grant
    Filed: December 14, 2011
    Date of Patent: March 19, 2013
    Assignee: Lextar Electronics Corp.
    Inventors: Bo-Yu Ko, Chun-Wei Wang, Sheng-Pei Lin
  • Patent number: D693780
    Type: Grant
    Filed: September 27, 2012
    Date of Patent: November 19, 2013
    Assignee: Lextar Electronics Corporation
    Inventors: Shing-Kuo Chen, Pei-Song Cai, Bo-Yu Ko, Chun-Wei Wang
  • Patent number: D695239
    Type: Grant
    Filed: November 27, 2012
    Date of Patent: December 10, 2013
    Assignee: Lextar Electronics Corporation
    Inventors: Bo-Yu Ko, Chun-Wei Wang, Pei-Song Cai
  • Patent number: D709039
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: July 15, 2014
    Assignee: Lextar Electronics Corporation
    Inventors: Bo-Yu Ko, Chun-Wei Wang, Shing-Kuo Chen
  • Patent number: D709040
    Type: Grant
    Filed: November 28, 2012
    Date of Patent: July 15, 2014
    Assignee: Lextar Electronics Corporation
    Inventors: Shing-Kuo Chen, Pei-Song Cai, Bo-Yu Ko, Chun-Wei Wang
  • Patent number: D782425
    Type: Grant
    Filed: July 24, 2014
    Date of Patent: March 28, 2017
    Assignee: Lextar Electronics Corporation
    Inventors: Bo-Yu Ko, Kuo-Wei Huang, Chun-Wei Wang