Light emitting diode package

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Description

FIG. 1 is a front perspective view of light emitting diode package showing the new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view thereof.

Claims

I claim the ornamental design for light emitting diode package, as shown and described.

Referenced Cited
U.S. Patent Documents
D607853 January 12, 2010 Kong
D608308 January 19, 2010 Hsieh
D608309 January 19, 2010 Kim
D621801 August 17, 2010 Hsieh
D628541 December 7, 2010 Lin
D630777 January 11, 2011 Lee
D632267 February 8, 2011 Chen et al.
D634284 March 15, 2011 Ko et al.
D634285 March 15, 2011 Ko et al.
D634286 March 15, 2011 Ko et al.
D638378 May 24, 2011 Ko et al.
Patent History
Patent number: D668624
Type: Grant
Filed: Nov 21, 2011
Date of Patent: Oct 9, 2012
Assignee: Lextar Electronics Corp. (Hsinchu)
Inventor: Bo-Yu Ko (New Taipei)
Primary Examiner: Selina Sikder
Attorney: Schmeiser Olsen & Watts LLP
Application Number: 29/406,971
Classifications
Current U.S. Class: Electron Or Vacuum Tube (23) (D13/180)