Wafer carrier

Info

Patent number: D674759
Type: Grant
Filed: Feb 18, 2011
Date of Patent: Jan 22, 2013
Assignee: Epistar Corporation (Hsinchu)
Inventors: Chung-Ying Chang (Hsinchu), Tzu-Ching Yang (Hsinchu)
Primary Examiner: Selina Sikder
Application Number: 29/385,727

Description

Description

FIG. 1 is a perspective view of the first embodiment showing the claimed design;

FIG. 2 is a front elevational view of FIG. 1;

FIG. 3 is a rear elevational view of FIG. 1;

FIG. 4 is a right side elevational view of FIG. 1, which is a mirror image of the left side elevational view;

FIG. 5 is a bottom plan view of FIG. 1, which is a mirror image of the top plan view;

FIG. 6 is a perspective view of the second embodiment showing the claimed design;

FIG. 7 is a front elevational view of FIG. 6;

FIG. 8 is a rear elevational view of FIG. 6;

FIG. 9 is a right side elevational view of FIG. 6, which is a mirror image of the left side elevational view;

FIG. 10 is a bottom plan view of FIG. 6, which is a mirror image of the top plan view;

FIG. 11 is a perspective view of the third embodiment showing the claimed design;

FIG. 12 is a front elevational view of FIG. 11;

FIG. 13 is a rear elevational view of FIG. 11;

FIG. 14 is a right side elevational view of FIG. 11, which is a mirror image of the left side elevational view;

FIG. 15 is a bottom plan view of FIG. 11, which is a mirror image of the top plan view;

FIG. 16 is a perspective view of the fourth embodiment showing the claimed design;

FIG. 17 is a front elevational view of FIG. 16;

FIG. 18 is a rear elevational view of FIG. 16;

FIG. 19 is a right side elevational view of FIG. 16, which is a mirror image of the left side elevational view;

FIG. 20 is a bottom plan view of FIG. 16, which is a mirror image of the top plan view;

FIG. 21 is a perspective view of the fifth embodiment showing the claimed design;

FIG. 22 is a front elevational view of FIG. 21;

FIG. 23 is a rear elevational view of FIG. 21;

FIG. 24 is a right side elevational view of FIG. 21, which is a mirror image of the left side elevational view;

FIG. 25 is a bottom plan view of FIG. 21, which is a mirror image of the top plan view;

FIG. 26 is a perspective view of the sixth embodiment showing the claimed design;

FIG. 27 is a front elevational view of FIG. 26;

FIG. 28 is a rear elevational view of FIG. 26;

FIG. 29 is a right side elevational view of FIG. 26, which is a mirror image of the left side elevational view; and,

FIG. 30 is a bottom plan view of FIG. 26, which is a mirror image of the top plan view.

Claims

The ornamental design for a “wafer carrier,” as shown and described.