Wafer holding member
Latest Tokyo Electron Limited Patents:
- SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- SURFACE ENERGY MODIFICATION IN HYBRID BONDING
- COMPONENT REPLACEMENT METHOD, COMPONENT REPLACEMENT DEVICE, AND COMPONENT REPLACEMENT SYSTEM
- SELECTIVE GAS PHASE ETCH OF SILICON GERMANIUM ALLOYS
- CONSUMABLE MEMBER, PLASMA PROCESSING APPARATUS, AND METHOD OF MANUFACTURING CONSUMABLE MEMBER
Description
The broken lines are shown for illustrative purposes only and form no part of the claimed design.
Claims
The ornamental design for wafer holding member, as shown and described.
Patent History
Patent number: D674761
Type: Grant
Filed: Mar 2, 2012
Date of Patent: Jan 22, 2013
Assignee: Tokyo Electron Limited (Minato-Ku)
Inventors: Naruaki Iida (Koshi), Hideki Kajiwara (Koshi)
Primary Examiner: Selina Sikder
Application Number: 29/414,719
Type: Grant
Filed: Mar 2, 2012
Date of Patent: Jan 22, 2013
Assignee: Tokyo Electron Limited (Minato-Ku)
Inventors: Naruaki Iida (Koshi), Hideki Kajiwara (Koshi)
Primary Examiner: Selina Sikder
Application Number: 29/414,719
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)