Semiconductor module for power conversion

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Description

FIG. 1 is a front view of a first embodiment of a semiconductor module for power conversion showing my new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a top view thereof;

FIG. 4 is a bottom view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is a front, right, top perspective view thereof;

FIG. 8 is a cross sectional view of the semiconductor module for power conversion of FIG. 1 taken along lines 8-8 of FIG. 1;

FIG. 9 is a front, right, top perspective view of the semiconductor module for power conversion of FIG. 1 shown in a used condition;

FIG. 10 a front view of a second embodiment of a semiconductor module for power conversion showing my new design;

FIG. 11 is a rear view thereof;

FIG. 12 is a top view thereof;

FIG. 13 is a bottom view thereof;

FIG. 14 is a right side view thereof;

FIG. 15 is a left side view thereof;

FIG. 16 is a front, right, top perspective view thereof;

FIG. 17 is a cross sectional view of the semiconductor module for power conversion of FIG. 1 taken along lines 17-17 of FIG. 10; and,

FIG. 18 is a front, right, top perspective view of the semiconductor module for power conversion of FIG. 10 shown in a used condition.

The broken lines shown in the drawings represent portions of the semiconductor module for power conversion that form no part of the claimed design.

Claims

The ornamental design for a semiconductor module for power conversion, as shown and described.

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Patent History
Patent number: D693318
Type: Grant
Filed: Mar 29, 2012
Date of Patent: Nov 12, 2013
Assignee: Sumitomo Electric Industries, Ltd. (Osaka-shi)
Inventor: Jiro Shinkai (Osaka)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/416,998