Pad arrangement of a circuit module

- Gemalto M2M GmbH
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Description

FIG. 1 is a bottom view of a first embodiment of a pad arrangement of a circuit module showing my new design;

FIG. 2 is a top view thereof;

FIG. 3 is a back view thereof;

FIG. 4 is a front view thereof;

FIG. 5 is a left side view thereof;

FIG. 6 is a right side view thereof;

FIG. 7 is a perspective view thereof; and,

FIG. 8 is a bottom view of a second embodiment of a pad arrangement of a circuit module showing my new design.

All surfaces not shown form no part of the claimed design.

Claims

The ornamental design for a pad arrangement of a circuit module, as shown and described.

Referenced Cited
U.S. Patent Documents
D466093 November 26, 2002 Ebihara et al.
D471167 March 4, 2003 Ebihara et al.
D471524 March 11, 2003 Ebihara et al.
D540272 April 10, 2007 Higashibata
D603812 November 10, 2009 Johnson et al.
D615506 May 11, 2010 Eide et al.
D638809 May 31, 2011 Morikawa et al.
D638810 May 31, 2011 Morikawa et al.
D651991 January 10, 2012 Nishiguchi et al.
D651992 January 10, 2012 Nishiguchi et al.
D655256 March 6, 2012 Nishiguchi et al.
D678227 March 19, 2013 Takahashi et al.
Patent History
Patent number: D699201
Type: Grant
Filed: Dec 31, 2012
Date of Patent: Feb 11, 2014
Assignee: Gemalto M2M GmbH (Munich)
Inventor: Carsten Petsch (Berlin)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/441,034