Pad arrangement of a circuit module
Latest Gemalto M2M GmbH Patents:
Description
All surfaces not shown form no part of the claimed design.
Claims
The ornamental design for a pad arrangement of a circuit module, as shown and described.
Referenced Cited
U.S. Patent Documents
D466093 | November 26, 2002 | Ebihara et al. |
D471167 | March 4, 2003 | Ebihara et al. |
D471524 | March 11, 2003 | Ebihara et al. |
D540272 | April 10, 2007 | Higashibata |
D603812 | November 10, 2009 | Johnson et al. |
D615506 | May 11, 2010 | Eide et al. |
D638809 | May 31, 2011 | Morikawa et al. |
D638810 | May 31, 2011 | Morikawa et al. |
D651991 | January 10, 2012 | Nishiguchi et al. |
D651992 | January 10, 2012 | Nishiguchi et al. |
D655256 | March 6, 2012 | Nishiguchi et al. |
D678227 | March 19, 2013 | Takahashi et al. |
Patent History
Patent number: D699201
Type: Grant
Filed: Dec 31, 2012
Date of Patent: Feb 11, 2014
Assignee: Gemalto M2M GmbH (Munich)
Inventor: Carsten Petsch (Berlin)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/441,034
Type: Grant
Filed: Dec 31, 2012
Date of Patent: Feb 11, 2014
Assignee: Gemalto M2M GmbH (Munich)
Inventor: Carsten Petsch (Berlin)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/441,034
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)