Semiconductor substrate

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Description

FIG. 1 is a front, right, and top perspective view of a semiconductor substrate showing our new design;

FIG. 2 is a front view thereof, a rear view being a mirror image thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a right-side view thereof, a left side view being a mirror image thereof;

FIG. 6 is a partially enlarged view at 6 shown in FIG. 2 thereof;

FIG. 7 is a partially enlarged view at 7 shown in FIG. 2 thereof;

FIG. 8 is an enlarged ended view at 8-8 shown in FIG. 3 thereof; and,

FIG. 9 is a partially enlarged sectional view at 9 shown in FIG. 8 thereof.

The broken line showing of the semiconductor substrate is for the purpose of illustrating environmental structure and forms no part of the claimed design.

Claims

The ornamental design for a semiconductor substrate, as shown and described.

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Patent History
Patent number: D651992
Type: Grant
Filed: Nov 19, 2010
Date of Patent: Jan 10, 2012
Assignee: Sumitomo Electric Industries, Ltd. (Osaka-shi, Osaka)
Inventors: Taro Nishiguchi (Itami), Makoto Sasaki (Itami), Shin Harada (Osaka), Shinsuke Fujiwara (Itami), Yasuo Namikawa (Osaka)
Primary Examiner: Selina Sikder
Attorney: Drinker Biddle & Reath LLP
Application Number: 29/379,485