Semiconductor device

- Fuji Electric Co., Ltd.
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Description

FIG. 1 is a front view of a semiconductor device showing my new design;

FIG. 2 is a rear view of the semiconductor device of FIG. 1;

FIG. 3 is a left side view of the semiconductor device of FIG. 1;

FIG. 4 is a right side view of the semiconductor device of FIG. 1;

FIG. 5 is a top view of the semiconductor device of FIG. 1;

FIG. 6 is a bottom view of the semiconductor device of FIG. 1; and,

FIG. 7 is a perspective view of the semiconductor device of FIG. 1.

The ornamental design of the present disclosure is a semiconductor device forming a case that may accommodate a plurality of semiconductor modules arranged in a line.

Claims

The ornamental design for a semiconductor device, as shown and described.

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Patent History
Patent number: D706232
Type: Grant
Filed: Jun 21, 2013
Date of Patent: Jun 3, 2014
Assignee: Fuji Electric Co., Ltd. (Kawasaki-shi, Kanagawa)
Inventor: Hideyo Nakamura (Kawasaki)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/458,663