Light emitting diode package

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Description

FIG. 1 is a front perspective view of a light emitting diode package showing the new design;

FIG. 2 is another perspective view thereof;

FIG. 3 is a front elevational view thereof;

FIG. 4 is a rear elevational view thereof;

FIG. 5 is a left side elevational view thereof;

FIG. 6 is a right side elevational view thereof;

FIG. 7 is a top plan view thereof; and,

FIG. 8 is a bottom plan view thereof.

Claims

The ornamental design for a light emitting diode package, as shown and described.

Referenced Cited
U.S. Patent Documents
D615052 May 4, 2010 Imai et al.
7825578 November 2, 2010 Takashima et al.
D637564 May 10, 2011 Tseng et al.
D669041 October 16, 2012 Imai et al.
D676000 February 12, 2013 Hussell et al.
D683708 June 4, 2013 Sasano et al.
D689451 September 10, 2013 Shimonishi et al.
D698322 January 28, 2014 Takeda et al.
20120299022 November 29, 2012 Hussell
Patent History
Patent number: D709041
Type: Grant
Filed: May 29, 2013
Date of Patent: Jul 15, 2014
Assignee: Lextar Electronics Corporation (Hsinchu)
Inventor: Zong-Han Yu (Keelung)
Primary Examiner: Selina Sikder
Application Number: 29/456,119
Classifications
Current U.S. Class: Electron Or Vacuum Tube (23) (D13/180)