Vacuum package machine
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The surface treatment of the vacuum package machine shown in the figures forms no part of the claimed design, a vacuum package machine according to the claimed design may have any surface treatment.
The broken lines illustrating portions of the vacuum package machine are for environmental purposes only and form no part of the claimed design.
Claims
We claim, the ornamental design for a vacuum package machine, as shown and described.
Type: Grant
Filed: Aug 14, 2013
Date of Patent: Dec 30, 2014
Assignee: Samsung Electronics Co., Ltd.
Inventors: Jinie Ryu (Seoul), Jongchan Kwon (Yongin-si), Ji Hyun Moon (Gwangmyung-si), YangJic Lee (Gwanchun-si), Sangmin Hyun (Seoul)
Primary Examiner: Patricia Palasik
Application Number: 29/464,208