Sensor module

- Samsung Electronics
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Description

This application makes reference to: U.S. Design application Ser. No. 29/491,674 filed May 22, 2014.

The above referenced application, and all of the subject matter disclosed therein, is incorporated herein by reference in its entirety.

FIG. 1 is a top left front perspective view of a sensor module showing our new design;

FIG. 2 is a rear elevation view thereof;

FIG. 3 is a front elevation view thereof;

FIG. 4 is a right side elevation view thereof;

FIG. 5 is a left side elevation view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a bottom right rear perspective view thereof.

The even length dashed broken lines are for environmental purposes only and form no part of the claimed design.

The uneven length dot-dash broken lines represent an unclaimed boundary line and form no part of the claimed design.

Any views of the sensor module that are not shown in the figures form no part of the claimed design.

Claims

The ornamental design for a sensor module, as shown and described.

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Patent History
Patent number: D730219
Type: Grant
Filed: May 22, 2014
Date of Patent: May 26, 2015
Assignee: Samsung Electronics Co., Ltd. (Suwon-si)
Inventors: Sheldon George Phillips (Glendale, CA), Frank Nuovo (Los Angeles, CA), Joseph J Kopp, Jr. (Fairfield, CA), Tom Torfs (Kraainem), Lindsay Brown (Mierlo), Seulki Lee (Eindhoven), Eva C. Wentink (Eindhoven)
Primary Examiner: Antoine D Davis
Application Number: 29/491,648