Cover for data relay device
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Description
The broken line shows portions of a cover for data relay device which form no part of the claimed design.
Claims
The ornamental design for a cover for data relay device, as shown and described.
Referenced Cited
U.S. Patent Documents
D342523 | December 21, 1993 | Morgan |
D364618 | November 28, 1995 | Somoza |
5901220 | May 4, 1999 | Garver |
D438532 | March 6, 2001 | Gargani |
D450686 | November 20, 2001 | Beaumont |
D454544 | March 19, 2002 | Takach, Jr. |
D471182 | March 4, 2003 | Cheung |
D543514 | May 29, 2007 | Katz |
D609901 | February 16, 2010 | Behar |
D637162 | May 3, 2011 | Bridgman |
D655280 | March 6, 2012 | MacManus |
D754111 | April 19, 2016 | Kwak |
D755762 | May 10, 2016 | Moon |
Patent History
Patent number: D768610
Type: Grant
Filed: Sep 18, 2014
Date of Patent: Oct 11, 2016
Assignee: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jihyun Moon (Gwangmyeong-si)
Primary Examiner: Bridget L Eland
Application Number: 29/502,679
Type: Grant
Filed: Sep 18, 2014
Date of Patent: Oct 11, 2016
Assignee: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Jihyun Moon (Gwangmyeong-si)
Primary Examiner: Bridget L Eland
Application Number: 29/502,679
Classifications
Current U.S. Class:
Acoustic Coupler Or Modem (22) (D14/242)