Signal I/O module

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Description

FIG. 1 is a front perspective view of a signal I/O module showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a left side view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a top view thereof;

FIG. 7 is a bottom view thereof; and,

FIG. 8 is a perspective view thereof in use.

The broken lines shown are included for the purpose of illustrating the unclaimed portions of the signal I/O module and form no part of the claimed design.

Claims

The ornamental design for a signal I/O module, as shown and described.

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Patent History
Patent number: D772172
Type: Grant
Filed: Jul 25, 2014
Date of Patent: Nov 22, 2016
Assignee: YOKOGAWA ELECTRIC CORPORATION (Tokyo)
Inventors: Naoto Takano (Musashino), Noriaki Senba (Musashino), Kouichirou Shimamura (Musashino), Hiroki Kuraishi (Musashino)
Primary Examiner: Susan E Krakower
Assistant Examiner: Camelia Styles
Application Number: 29/497,558