Processor package
- Intel
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Description
FIG. 1 is a perspective view of a processor package including an indented area on a surface.
FIG. 2 is a front view of the processor package.
FIG. 3 is a top view thereof.
FIG. 4 is a back view of the processor package.
FIG. 5 is a right side view thereof.
FIG. 6 is a left side view thereof.
FIG. 7 is a bottom view thereof; and,
FIG. 8 is a cross-sectional view thereof, taken along line 8--8 of FIG. 2.
Referenced Cited
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Patent History
Patent number: D426201
Type: Grant
Filed: Dec 22, 1997
Date of Patent: Jun 6, 2000
Assignee: Intel Corporation (Santa Clara, CA)
Inventor: Thomas S. Klinker (San Francisco, CA)
Primary Examiner: M. H. Tung
Law Firm: Blakely, Sokoloff, Taylor & Zafman LLP
Application Number: 0/81,115
Type: Grant
Filed: Dec 22, 1997
Date of Patent: Jun 6, 2000
Assignee: Intel Corporation (Santa Clara, CA)
Inventor: Thomas S. Klinker (San Francisco, CA)
Primary Examiner: M. H. Tung
Law Firm: Blakely, Sokoloff, Taylor & Zafman LLP
Application Number: 0/81,115
Classifications
Current U.S. Class:
D14/114
International Classification: 1402;
International Classification: 1402;