Sensor module
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Description
The even length dashed broken lines illustrate portions of the sensor module that form no part of the claimed design.
Any views of the sensor module that are not shown in the figures form no part of the claimed design.
Claims
The ornamental design for a sensor module, as shown and described.
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Patent History
Patent number: D775542
Type: Grant
Filed: May 26, 2015
Date of Patent: Jan 3, 2017
Assignee: SAMSUNG ELECTRONICS CO., LTD. (Suwon-Si)
Inventors: Sheldon George Phillips (Glendale, CA), Frank Nuovo (Los Angeles, CA), Joseph J Kopp, Jr. (Fairfield, CA), Tom Torfs (Kraainem), Lindsay Brown (Mierlo), Seulki Lee (Eindhoven), Eva C. Wentink (Eindhoven)
Primary Examiner: Antoine D Davis
Application Number: 29/528,113
Type: Grant
Filed: May 26, 2015
Date of Patent: Jan 3, 2017
Assignee: SAMSUNG ELECTRONICS CO., LTD. (Suwon-Si)
Inventors: Sheldon George Phillips (Glendale, CA), Frank Nuovo (Los Angeles, CA), Joseph J Kopp, Jr. (Fairfield, CA), Tom Torfs (Kraainem), Lindsay Brown (Mierlo), Seulki Lee (Eindhoven), Eva C. Wentink (Eindhoven)
Primary Examiner: Antoine D Davis
Application Number: 29/528,113
Classifications