Heat insulating unit for substrate processing apparatus
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Description
Claims
We claim the ornamental design for a heat insulating unit for substrate processing apparatus, as shown (and described).
Referenced Cited
U.S. Patent Documents
| D440138 | April 10, 2001 | Campbell |
| D599386 | September 1, 2009 | Moellering |
| D613245 | April 6, 2010 | Honna |
| D654211 | February 14, 2012 | Melzner |
| D670247 | November 6, 2012 | Savill, Jr. |
| D703238 | April 22, 2014 | Ueno |
| D709323 | July 22, 2014 | Brown |
| 9082694 | July 14, 2015 | Saido |
| 9134052 | September 15, 2015 | Kuo |
| D758317 | June 7, 2016 | Plassiard |
| D766833 | September 20, 2016 | Plassiard |
Patent History
Patent number: D788705
Type: Grant
Filed: Feb 18, 2016
Date of Patent: Jun 6, 2017
Assignee: HITACHI KOKUSAI ELECTRIC INC. (Tokyo)
Inventors: Hideto Tateno (Toyama), Daisuke Hara (Toyama)
Primary Examiner: Daniel Bui
Assistant Examiner: Andrew Kerr
Application Number: 29/555,040
Type: Grant
Filed: Feb 18, 2016
Date of Patent: Jun 6, 2017
Assignee: HITACHI KOKUSAI ELECTRIC INC. (Tokyo)
Inventors: Hideto Tateno (Toyama), Daisuke Hara (Toyama)
Primary Examiner: Daniel Bui
Assistant Examiner: Andrew Kerr
Application Number: 29/555,040
Classifications